Wafer Mounter&OCR System

[Coreonix]

엠티에스코리아

031 499 9790

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📄 Wafer Mounter System

1. 장비 개요

 Saw 공정이 완료된 Wafer를 Ring Frame에 정밀 정렬하여 Mounting(Bonding)하고, Frame ID 각인 및 Bar-Code 인쇄, OCR/Barcode 검사까지 자동으로 수행하는 통합 자동화 설비입니다.
Frame Magazine의 자동 적재 및 배출 기능을 포함하여 생산 효율성과 품질 신뢰성을 동시에 확보합니다.

항목	내용
장비명	Wafer Mounter & OCR Integrated System
적용공정	Back-End (Saw / Dicing 전 공정)
기능	Wafer UV Tape Mounting + Wafer ID OCR + Barcode Verification + Ring Frame Assembly
적용웨이퍼	8", 12" (Option: 6")
적용 Tape	UV Dicing Tape (8/12 inch reel type)
생산성	≥ 120 WPH (12인치 기준)

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2. 공정 Flow

1. FOUP Load
2. Dual Arm Wafer Handling Robot
3. Wafer Aligner (Pre-Align & Notch/Flat Detect)
4. Wafer Flipper
5. Wafer Mount Table (Vacuum Chuck)
6. UV Tape Reel Module (Auto Tension Control)
7. Ring Frame Auto Loader
8. Pick & Place Module
9. Secondary Flipper (Front/Back OCR 대응)
10. C/V Conveyor (Vision Inspection Path)
11. OCR Vision Module
12. Barcode Printer
13. Rotation Unit (0~360°)
14. Barcode Reader (2D/1D)
15. Wafer Ring Pusher
16. Bin Cassette Buffer (3 Port)
17. Elevator Transfer System
18. Ring Frame Receiving Position
19. Auto Unload to Cassette

3. 주요 모듈 사양

3.1 FOUP & 로딩 시스템

항목	사양
FOUP Type	SEMI E47 / E62 compliant
Load Port	2~4 Port (Option)
Mapping	Slot Mapping Sensor
OHT Interface	SEMI E84 Support

3.2 Wafer Handling Robot

항목	사양
Type	Dual Arm SCARA or Vacuum Robot
Repeatability	±0.02 mm
Particle Spec	Class 1 Compatible
Wafer Size	8" / 12"

3.3 Wafer Aligner

항목	사양
Alignment Accuracy	±0.05°
Notch Detection	IR + Vision Hybrid
Run-out Accuracy	≤ 0.1 mm

3.4 Flipper Unit

항목	사양
Rotation	180° Flip
Handling Type	Vacuum Edge Grip
Breakage Rate	≤ 0.01%

3.5 UV Tape Reel Module (최신형)

항목	사양
Tape Type	UV Curable Dicing Tape
Reel Auto Change	Optional Auto Splice
Tension Control	Closed-loop Servo Control
Tension Accuracy	±2%
Bubble Detection	Inline Vision Detection

3.6 Wafer Mount Table

항목	사양
Chuck Type	Vacuum Porous Chuck
Flatness	≤ 5 μm
Lamination Pressure	Programmable
Lamination Speed	50~300 mm/sec
Air Bubble Reject	Auto Detect & Retry

3.7 OCR Vision Module (최신 AI Vision 적용)

항목	사양
Camera	12~25MP Industrial Camera
Lighting	Coaxial + Side IR
OCR Type	Laser Mark / Ink Mark
Recognition Rate	≥ 99.98%
AI Deep Learning	Character Self-Learning
Data Interface	SECS/GEM, OPC-UA

3.8 Barcode System

항목	사양
Printer	300~600 dpi Thermal Transfer
Reader	1D/2D (Data Matrix)
Verification	ISO/IEC 15415 Grade A/B
Inline Reject	Auto Diverter

3.9 Rotation Unit

항목	사양
Range	0~360°
Resolution	0.01°
Control	Servo Motor

3.10 Bin Cassette Buffer

항목	사양
Capacity	3 Cassette
Elevator Stroke	300~500 mm
Auto Positioning	±0.05 mm

4. 시스템 제어 사양

항목	사양
Controller	Industrial PC + PLC
HMI	15~21 inch Touch Panel
Communication	SECS/GEM, OPC-UA, Ethernet/IP
Data Logging	MES 연동
Recipe Management	Lot별 자동 변경

5. 공정 성능 지표 (KPI)

항목	목표
Throughput	≥120 WPH (12")
MTBF	≥ 1000 hr
MTTR	≤ 30 min
OCR Error Rate	≤ 0.02%
Particle Spec	ISO Class 3

6. 안전 및 규격

• SEMI S2, S8 준수
• CE 인증 대응
• ESD Safe Design
• Interlock Safety Door
• UV Shield Cover

7. 스마트팩토리 대응

• AI 기반 OCR 학습 기능
• 공정 데이터 실시간 분석
• Remote Maintenance
• Predictive Maintenance (Motor/Vacuum Monitoring)
• Big Data Export

8. 옵션 사항

• Auto Tape Splicing
• Dual OCR (Pre/Post Mount)
• UV Irradiation Module
• 6inch Conversion Kit
• OHT Full Automation